Job Details:

Job Description: 

As a Packaging Module Development Engineer, you will play a pivotal role in advancing Intel's cutting-edge assembly packaging platform technologies. Through your expertise in developing innovative solutions, optimizing processes, and collaborating with cross-functional teams, you will contribute to Intel's mission to deliver industry-leading semiconductor packaging technologies.

You will be instrumental in ensuring the quality, reliability, and scalability of Intel's packaging solutions, ultimately driving to meet customer needs for emerging mobile, edge, and hyperscale computing platforms.

Note: This role requires regular onsite presence to fulfill essential job responsibilities.

The Packaging Module Development Engineer:

• Develops assembly materials, processes and/or equipment and applies novel concepts for innovative solutions to enable Intel's roadmap of future assembly packaging platform technologies.
• Optimizes and improves the efficiency of manufacturing of packages, developing processes to meet quality, reliability, cost, yield, productivity, and manufacturability requirements.
• Develops materials, process and equipment specifications applying principles for design of experiments and data analysis, and documents improvements through white papers.
• Develop materials technologies to integrate with module equipment and processes that can withstand and survive under simulated field use conditions, such as heat, humidity, temperature cycle, and dynamic forces.
• Ensures manufacturability of physical layout of package design and oversee the cycle of manufactured package processes, procedures, and flows.
• Establishes material specifications for contract assemblers and raw material vendors and interfaces with supplier quality and procurement teams to ensure material quality and vendor performance requirements are met through strict adherence to process specifications and existing product qualification methods.
• Develops new materials characterization techniques and acceleration methods, tools, and quality screens to ensure the early identification of potential problems with packaging materials quality and reliability.
• Sets reliability requirements to meet customer needs and influences design, material selection and process development to meet those needs, based on fundamental materials structure-property-performance understanding of failure mechanisms.
• Leads efforts towards innovating, problem solving, developing, and continuously improving materials, equipment and processes using experimental design and statistical methods.
• Provides materials expertise concerning packaging problems and improvements in the packaging process and responds to customer/client requests or events as they occur.
• Delivers standardization in product qualification, manufacturing quality systems, and methods and continuously engages with packaging technology development and partner engineering groups on process/technology maturity for products towards key risk areas in meeting product milestones.

The ideal candidate should show the following behavioral traits:

• Strong communication and influencing skills.

Qualifications:

Minimum qualifications are required to be initially considered for this position.

• Bachelor's degree with 6+ years of experience in the field of Metallurgy or Materials Science or Polymer Science or Polymer Chemistry or Physics or Chemical Engineering.
• OR Master's degree with 4+ years of experience in the field of Metallurgy or Materials Science or Polymer Science or Polymer Chemistry or Physics or Chemical Engineering.
• OR, or PhD in the field of Metallurgy or Materials Science or Polymer Science or Polymer Chemistry or Physics or Chemical Engineering.

• Experience listed above should be a combination of the following:
• Design of experiments, statistical methods, and process characterization.
• Packaging materials, assembly processes, and equipment development relevant to semiconductor technologies.
• Die packaging, quality/reliability for packaging, and disciplined execution of manufacturing solutions.
• Data analysis and statistical principles.
• Design of Experiments, materials characterization principles and tools.

Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

• Knowledge of Intel and general semiconductor packaging and assembly technologies.
• Experience communicating with suppliers and driving supplier technology development.
• Experience leading and coaching technical teams in a matrixed environment.
• Technical innovation and delivery of results for complex, time-critical technical projects.
• Hands-on experience in semiconductor fabrication processes and technology.
• Prior experience with dispense, mold, or cure equipment technologies in packaging development.

Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.

Join us in shaping the future of semiconductor assembly and packaging technology by applying your expertise to drive innovation, optimize processes, and deliver solutions that enable Intel's transformative platforms.

          

Job Type:

College Grad

Shift:

Shift 1 (United States of America)

Primary Location: 

US, Arizona, Phoenix

Additional Locations:

Business group:

Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

 

 

Annual Salary Range for jobs which could be performed in the US: $115,110.00-188,890.00 USD

 

 

The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

 

 

Work Model for this Role

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

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ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.