at Apple
Location
San Diego, United States of America
Compensation
$181k–$318k USD
Type
full time
Posted
1 weeks ago
Market range · company + function + seniority
p25 · target · p75 · n=800
Posted $318k · in the market band
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- Lead RFSIP package substrate development, pathfinding technology, and roadmap definition.
- Work with substrate manufacturing industry, foundry, and OSAT to bring package substrate solution from concept to HVM.
- Work across a variety of cross-functional groups directly and involve themselves in engineering and product development.
- Drive industry with sophisticated package solutions, new material development, and specs.
- 5% International travel.
Work with industry partners to develop new substrate technologies from concept to HVM for Apple packaging roadmap.
Work with cross-functional groups to define & optimize new package substrate architectures based on performance, technical risk, cost, and availability etc.
Problem solving of technical issues during the full product development cycle.
BS and 10+ years of relevant industry experience.
MS or Ph.D. and 5+ years of relevant industry experience.
Proven fundamentals in the material/chemistry/ or mechanical engineering field(s).
In-depth knowledge of substrate technology, manufacturing process, design rules, and roadmap.
Hands-on experience in substrate manufacturing and technology development: Cu plating, Lithography, Dielectric material, Laser via formation, Solder resist, etc.
Familiar with package assembly and integration process preferred.
Experience in Cadence Allegro platform tools and design review for manufacturing (DFM).
Exceptional technology development & project management skills.
Strong communication & collaborative skills.
At Apple, we believe new insights have a way of becoming extraordinary products, services, and customer experiences very quickly. Our Hardware Technology Packaging team invents, designs, develops, and integrates electronic packaging solutions for Apple's internal and custom external components of hardware for its consumer electronic products such as iPhone, iPad, Mac, Apple Watch, Apple TV, etc. In this highly visible role, you will own and drive sophisticated package selection, new-generation product package structure and configuration optimization. You will be responsible for Apple Package substrate including design, technology, manufacturing, and reliability, and future roadmap; and work with a cross-functional team to achieve the best package performance.
At Apple, base pay is one part of our total compensation package and is determined within a range. This provides the opportunity to progress as you grow and develop within a role. The base pay range for this role is between $181,100 and $318,400, and your base pay will depend on your skills, qualifications, experience, and location.Apple is an equal opportunity employer that is committed to inclusion and diversity. We seek to promote equal opportunity for all applicants without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or other legally protected characteristics. Learn more about your EEO rights as an applicant
At Apple, we believe accessibility is a fundamental human right. You’ll find that idea reflected in everything here — in our culture, our benefits and our digital tools. By welcoming as many perspectives as possible, we help you build a career where you feel like you belong.
Learn about accessibility in Apple’s workplace
Learn about reasonable accommodations for job applicants
Apple accepts applications to this posting on an ongoing basis.
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