at Apple
Location
San Francisco Bay Area, United States of America
Compensation
$181k–$318k USD
Type
full time
Posted
3 months ago
Market range · company + function + seniority
p25 · target · p75 · n=800
Posted $318k · in the market band
Posting health
Aging · 65Tailor your résumé to this role in 30 seconds.
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• In this fast-paced environment, your role is to interface between internal product/device design, quality, supply chain, and the external suppliers to develop and deploy new packaging technologies.
• We are looking for individuals who are very innovative with a proven track record to
Define new package characteristics based on unique module and system level performance, cost, and footprint requirements.
Define package/packaging specifications.
Work with suppliers on package design, new material, new equipment selection and process/process flow development.
Perform initial proof of concept sample build, POR establishment, package and process qualification, reliability test, yield analysis and enhancement.
Coordinate with other packaging and cross-functional team members to comply with product development/ramp schedule.
Deliver package/packaging milestones on time.
Define packaging roadmap based on long term packaged product requirements.
Work closely and Manage suppliers’ R&D activities.
BS and 10+ years of relevant industry experience.
M.S or Ph.D. degree in mechanical engineering, physics, materials science or similar disciplines with a minimum of 10 years of experience in IC packaging. AutoCAD, APD and multi-physics simulation knowledge is a plus.
Some hands-on knowledge in Wafer Bumping, Manufacturing assembly processes; such as wafer back-grind, wafer dicing, Flip Chip die attach (including multilayer thin die stacking), encapsulation/molding, under-fill, ball attach, package singulation and Tape & Reel.
In-depth knowledge in Wafer Level Chip Scale Packaging (RDL/Wafer Bumping & BEOL Assembly processes for Fan-In & Fan-Out designs).
Expert level knowledge of common reliability failure modes. Able to understand device physics and component/board level reliability testing.
Proven track record to bring a product/package from conceptual stage to development and to HVM environment.
Ability to construct Designs of Experiments and down-select materials and processes.
Good written and verbal communication skills. Able to present ideas, design concepts, data and plan with high confidence at team meetings and executive review meetings.
Able to perform independent research and development work with minimal supervision.
Looking for a senior level IC packaging engineer to develop exciting new products. You will be responsible providing Custom Silicon packaging solutions in a module/system for various consumer markets.
At Apple, base pay is one part of our total compensation package and is determined within a range. This provides the opportunity to progress as you grow and develop within a role. The base pay range for this role is between $181,100 and $318,400, and your base pay will depend on your skills, qualifications, experience, and location.Apple is an equal opportunity employer that is committed to inclusion and diversity. We seek to promote equal opportunity for all applicants without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or other legally protected characteristics. Learn more about your EEO rights as an applicant
At Apple, we believe accessibility is a fundamental human right. You’ll find that idea reflected in everything here — in our culture, our benefits and our digital tools. By welcoming as many perspectives as possible, we help you build a career where you feel like you belong.
Learn about accessibility in Apple’s workplace
Learn about reasonable accommodations for job applicants
Apple accepts applications to this posting on an ongoing basis.
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