at Apple
Location
San Francisco Bay Area, United States of America
Compensation
$185k–$325k USD
Type
full time
Posted
Yesterday
Market range · company + function + seniority
p25 · target · p75 · n=800
Posted $325k · above the band
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You'll drive package integration across SoC and advanced 2.5D / 3D packaging projects, from architecture trade-off studies through characterization, modeling, and product delivery. You'll manage process development and enable MP-ready packaging solutions on product, own complex technical deliverables end-to-end, and lead DOEs and build execution with foundry and OSAT partners. You'll also serve as a technical anchor across design, test, reliability, and product teams. We're looking for a seasoned engineer with deep packaging expertise, strong cross-functional and supplier partnership skills, and a solution-oriented mindset grounded in engineering physics.
Lead packaging technology development, including advanced 2.5D / 3D packaging
Own SoC package integration end-to-end, driving multi-functional teams across design, test, reliability, and product
Drive package architecture and package integration innovation
Partner with foundry and OSAT to bring packaging solutions from concept to HVM.
Influence the industry through sophisticated package solutions, new material development, and spec definition
5% International travel
BS and 10+ years of relevant industry experience or equivalent
MS or PhD in a relevant discipline, with a thesis or coursework in semiconductor packaging, materials, thermal, mechanical, or electrical modeling
Deep experience in the Semiconductor Packaging field, with a proven track record taking packages from concept to HVM
Established expertise in Wafer Level Packaging, 2.5D packaging, and 3D packaging technology.
Strong knowledge in materials characterization and analysis.
Broad understanding of packaging technologies, assembly processes, IC packaging materials, reliability standards, and FA techniques.
Proven experience with package design software (APD, Virtuoso, or equivalent).
Demonstrated experience in memory packaging.
Excellent interpersonal skills, with a track record of strong business partnerships and cross-functional collaboration, including overseas suppliers.
Ability to work independently and orchestrate complex, multi-team projects with minimal supervision.
Solution-oriented engineer with proven fundamentals in engineering physics.
Strong program management skills.
Do you like to work on groundbreaking technology? Have a passion for creating amazing products? Our team is looking for a hardworking, IC Packaging Engineer with strong attention for details and love for excellence and precision to accomplish extraordinary results. In this highly impactful role, you will initiate package concepts, own and drive sophisticated package selection, new product package structure and configuration optimization. You will be responsible for packaging integration and package technology development for a variety of projects including SoC.
At Apple, base pay is one part of our total compensation package and is determined within a range. This provides the opportunity to progress as you grow and develop within a role. The base pay range for this role is between $184,700 and $324,800, and your base pay will depend on your skills, qualifications, experience, and location.Apple is an equal opportunity employer that is committed to inclusion and diversity. We seek to promote equal opportunity for all applicants without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or other legally protected characteristics. Learn more about your EEO rights as an applicant
At Apple, we believe accessibility is a fundamental human right. You’ll find that idea reflected in everything here — in our culture, our benefits and our digital tools. By welcoming as many perspectives as possible, we help you build a career where you feel like you belong.
Learn about accessibility in Apple’s workplace
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Apple accepts applications to this posting on an ongoing basis.
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